Ashish Agrawal

Working as Lead Engineer to design and develop Software Defined Vehicle stack & Compute Consolidation for Automotive group in Intel. Intel roadmap for automotive use-case is growing, we have a line of SKUs to offer and multiple active engagement with wide range of customers. My primary focus is in the area of Audio Software stack as well as around QNX Safety-OS and QNX Hypervisor integration to our SDV Software stack.

Worked for Infineon and Intel Deutschland GmbH as lead engineer for embedded component design and development. System profiling and real time monitoring - concept development and implementation. Tools & Technology: Threadx RTOS variant for Intel platforms. ARM9, ARM11 and ARM CortexA5/R5 MC chipsets. Lauterbach debugging Virtual Prototype for Multi-Core. ICC, ARMCC and GCC cross compilers. IBM CC and CQ, git/gerrit/Jenkins, JIRA, continuous integration.

Component Lead for several components: Flash driver, SD Card Driver, Image Update, OMA DM/CP. Image Update: Module owner of Image Down-Load Feature. Implementation of download-mode in Boot-Loader. Wrote jump points for image-download-mode in boot-loader. Tools & Technology: Power-Monitor, Trace32-ICD for HW Debugging. KITL debugging using PB for SD Host Controller Driver. Used CRO for testing current/Voltage and interrupt triggers for various SD Card PINS on Board.

Implemented a complete solution to create SSL connection between User & Server and securely complete transaction for possible changes in user credentials without logging into the system, this solution saved lot of useful server-session-time. Wrote many Admin-Settings related modules & did testing & Bug Fixing of VPN Connections for Max Load Connection scenarios.

Information Systems, Software Engineering, Advance Database management system, Conceptual Modelling, Object Orientation,

Operating Systems, Data Structures, Theory of Computation, Software Engineering, Computer Networks, C and C++ programming Languages, Database Management Systems, Computer Graphics, Digital Data Communications, Microprocessors and System Design, Artificial Intelligence