Dr. ChingJui Shih

Bis 2012, Mechanical Engineering, National Taiwan University

Taipei, Taiwan

Über mich

MEMS Designer with experiences of Modeling, Simulations, Theory and method Development in MEMS devices, including inertial sensor, microphone and else. I’m seeking opportunities in Product development and CAE simulation.

Fähigkeiten und Kenntnisse

Sensor technology
MEMS
ANSYS
SolidWorks
AutoCAD
Pro/E
Python
C/c++
MatLab
Software Development
CAD
Engineering
Technology
Project Management
CAE
Modeling
FEM
Mechanical Engineering
Simulink

Werdegang

Berufserfahrung von ChingJui Shih

  • 1 Jahr und 8 Monate, Mai 2022 - Dez. 2023

    R&D Director

    Raytronic Inc.

     Designed the required function of 3 axis MEMS gyroscope.  CAD simulation and modeling for Quadrature signal demodulation  System-level simulation via Simulink.  Data analysis and data management via programming (python, C/C++)

  • 2 Jahre und 1 Monat, Mai 2020 - Mai 2022

    Sr. MEMS design Manager

    Miradia Inc.

     Designed the required function of 3 axis MEMS gyroscope.  CAD simulation and modeling for gyro structure  Designed the required function of force sensor. . conducted verification/test plan

  • 2 Jahre, Juni 2018 - Mai 2020

    Sr. Product Manager

    MEMSIC Semiconductor

     Implement physic coupling solution in resonate state of MEMS gyro by CAE tool.  Survey and study new project including SAW sensor and Proximity sensor.  Lead a team of 5 engineers to design the required function of MEMS gyro. Special achievements Built-up CAE platform for MEMS Gyroscope from concept to prototype, including modal, Harmonic, spring soften, sensitivity, Capacitance, damping and else.

  • 4 Jahre und 5 Monate, Jan. 2014 - Mai 2018

    Deputy Manager

    Yizhou technology

    • Design the required function or features of MEMS inertial sensor (such as accelerometer and gyroscope) merge with ASIC. • Conducted sensor verification via reliability test, including mechanical shock, vibration, HTOL, HTSL, Pre-condition, PCT, TCT (from JEDEC). • Debug sensor-related technical issue, including ESD, EMI, quality issues and Conduct PFA、EFA and MEMS structure analysis • Conducted verification of MEMS die via CP test in wafer-level.

Ausbildung von ChingJui Shih

  • 2 Jahre und 6 Monate, Sep. 2009 - Feb. 2012

    Mechanical Engineering

    National Taiwan University

    MEMS IMU sensor/CAE tool

Sprachen

  • Englisch

    Gut

  • Deutsch

    Grundlagen

  • Chinesisch

    Muttersprache

Interessen

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