Dhanesh Thekkath

Bis 2019, Junior Process Engineer, Flex

Bangalore, Indien

Über mich

I am really happy to have your eye over my content. Probably this is the happiest moment for me. Professional Experience : Overall 7 years of experience in Electronics manufacturing field . Expertise in Process and Quality department activities . Currently serving at Schneider Electric as a Deputy Manager-PCBA Method .Focused on Process and Machine and NPI Qualifications, Failure Analysis in SMT,THT,Assembly and Conformal Coating Associated with Automotive ,Mobile ,Medical & Aerospace Products . Expertise in SMT ,Through hole Operations ,Box Build ,Final Assembly & Testing's, Reliability tests ,Cable and wire harness. Expertise in NPI activities, Failure analysis ,DFM/DFA ,Continuous Improvement ,Internal Audit ,Product & IPC Internal Trainings, Quality Tools, SCAR ,8D,MSA,APQP,PPAP,FAI ,FMEA ,CP & Document preparation . Educational Qualification : 15 years of regular education and holding 3 year Diploma in Electronics Engineering .

Fähigkeiten und Kenntnisse

FMEA
Kaizen
Manufacturing engineering
Process Optimization
Process Development
Minitab
PCBA
Quality Assurance
Process capability
SMT
Wave soldering
Failure analysis
8D
Audit
MS Office
Design for manufacturing (DFM)
IATF 16949
PCB DFM
Supplier Evaluation
Supplier selection
GC preview
Jigs and fixtures
New Product Introduction
New Product Development
Risk Analysis

Werdegang

Berufserfahrung von Dhanesh Thekkath

  • Bis heute 1 Jahr und 9 Monate, seit Sep. 2022

    Manufacturing Specialist PCBA

    Schneider Electric

  • 2 Jahre und 1 Monat, Sep. 2020 - Sep. 2022

    Senior Process Engineer

    Wistron

    Project : Apple products Failure analysis ,SMT line qualifications,Process capability studies ,8D,NPI process,FATP process,Control plan ,FMEA,RCCA,7QC tools,Yield improvement,Cross section analysis ,SEM & EDX ,X-ray ,VHX ,IR ,FTIR test dye and pry test

  • 9 Monate, Jan. 2020 - Sep. 2020

    Supplier Quality Consultant PCBA

    Landis+Gyr

    Supplier Quality Engineering , DFM/DFA analysis ,NPI engineering ,Supplier development ,supplier evaluation ,supplier selection

  • 1 Jahr, Dez. 2018 - Nov. 2019

    Junior Process Engineer

    Flex

    Project : Apple products ,Reliance Jio,Moto SMT and THT failure analysis , Line qualifications ,Continuous improvement,Kaizen,Scrap and downtime reduction ,DFM/DFA analysis

  • 3 Jahre und 4 Monate, Aug. 2015 - Nov. 2018

    Process Supervisor

    SFO Technologies

    Project : Stanley Black and Decker,GE healthcare,Alstom ,Rafael ,Thales ….etc Worked as SMT & TH Quality/Process Engineer,NPI Process Quality & Supplier Quality Activities

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