Package Design Engineer, ___
Munich, Deutschland
Bis heute
Texas Instruments
___
-
SENIOR PCB DESIGN ENGINEER
Bietigheim-Bissingen
Mechatronics Engineer
Bucarest
Biomedical engineering
Tirana
Principal Engineer
Chandler
Geschäftsführer
München
Senior Power Electronics Engineer (Entwicklungsingenieur)
Munich
IC Package Design Engineer
Seoul
FPGA Engineer
Eningen unter Achalm
Senior Expert vehicle Integration / Package / Design Studion engineer by
Hangzhou Bay
Elektrotechnik
Berlin
Entwicklungsingenieur Hardware
Kiel
---
Dresden
Projects Engineer
Jeddah
Firmware Developer
Ascheberg
21 Mio. XING Mitglieder, von A bis Z
Nachname: