SABRISH MENON

Angestellt, Senior Physical Design Verification Engineer, Qualcomm CDMA Technologies

Bangalore, Indien

Über mich

> Having a total exp of 5+ years into Physical Verification/Sign-off for multiple projects on TSMC, INTEL & UMC processors using TSMC 7m, 16m & Intel specific 10nm,14nm, 22m & UMC 40m technology node. > Activities include DRC, FM, LVS, ERC, PERC Checks, DENSITY, LATCH- UP, ANTENNA, floorplan checks, soft-check, stamping conflict, scripting, cross-talk, RV & PDN fixes, EM, IR drop & ECO implementation. > Worked on multiple SOC/Sub-system/Blocks using Synopsys ICC, ICC-Il, IC Validator (ICV), Mentor Calibre,Cadence Innovus & Virtuoso tool for sign-off activity. > Led the team for couple of Tape-ins with Intel account, activities include driving the Block & Subsystem level sign-off checks, managing resources & assigning work to team members to delivering the GDS for Tape-in.

Fähigkeiten und Kenntnisse

Physical design
CROSS TALK ANALYSIS
Antenna fixes
Placement
Eco implementation
Tcl scripting
Engineering
Linux
CTS
Physical verification
FloorPlanning
DRC
LVS
Innovus
ICC
Caibre

Werdegang

Berufserfahrung von SABRISH MENON

  • Bis heute 4 Jahre und 7 Monate, seit Nov. 2019

    Senior Physical Design Verification Engineer

    Qualcomm CDMA Technologies

    - Certified ASIC Engineer with 5+ Years of experience as Physical Verification Engineer. - Hands on experience in EDA tool- ICC II, Innovus, IC Validator, IC Workbench, Mentor Calibre - Proficient in using INNOVUS/ICC II tool to fix DRC, LVS, DFM, Antenna, Softcheck, ERC, Crosstalk, EM, IR drop & ECO implementation. - Tech nodes worked on 4nm, 5nm, 7nm, 10nm, 14nm of Foundries like TSMC, Samsung & Intel. - Hands on experience in Floorplan, Placement, congestion removal, Routing & signoff activities.

  • 2 Jahre und 3 Monate, Sep. 2017 - Nov. 2019

    Design Engineer

    Intel Corp.

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