Nikolay Bodunov
Bis 2013, HPC Hardware R&D Team Lead, T-Platforms
Moscou, Russische Föderation
Werdegang
Berufserfahrung von Nikolay Bodunov
Bis heute 4 Jahre und 6 Monate, seit Dez. 2019
Motherboard Engineer
Gagarin
Server motherboard bring-up (OpenCompute, Tioga Pass, Purley platform) Debug high-speed interfaces: memory (Intel Memory Margin Analyzer), UPI, PCIe, SATA, USB with Intel System Debugger + CScripts + JTAG XDP (mc.*, upi.*, pci.*, pch.*, error.*), BKC approach OpenBMC (AST2500): customization to the motherboard, search VRs soldering bugs through hwmon UEFI BIOS: - HII localization, UEFI update - SMBIOS + FRU implementation - choose IBV for the motherboard, UEFI features prioritization
1 Jahr und 9 Monate, März 2018 - Nov. 2019
R&D Engineer
Open Mobile Platform
Adaptation of the device drivers to the new peripherals. Configure uboot, uEnv.txt, tftp booting. I2c, spi peripherals. UIO, IIO, Input frameworks. Devicetree, interrupts. Work with Buildroot, Yocto. Co-development secured smartphone with Chinese IDH. The smartphone includes hardware switching off for sensors: touchscreen, camera, mic etc. Writing SOW, both block and state diagrams. ARM Cortex A-53(MT6737, MT6739).
4 Jahre und 2 Monate, Jan. 2014 - Feb. 2018
R&D Engineer
Auriga
Tablet PC development (15" 4K UHD display, Intel Skylake i7 CPU) in a distributed team. Writing tech specs, schematics and PCB co-development, board bring-up, drivers, cooling system. Writing UEFI BIOS edk2 HII modules, fonts localization with creating local symbols, create forms. Wrote 3 articles on the topics of UEFI (on Russian): https://habr.com/ru/post/338264/ https://habr.com/ru/post/338404/ https://habr.com/ru/post/338634/
2 Jahre und 8 Monate, Mai 2011 - Dez. 2013
HPC Hardware R&D Team Lead
T-Platforms
Development HPC rack with hot water cooling. https://www.t-platforms.ru/upload/uf/19d/A_Class_Scalable.pdf Writing tech specs for motherboards, Infiniband/Ethernet switches, backplanes, water-cooled coldplates. Define mechanics, power and signal distribution inside the backplanes and the rack Work with both OEMs and outsourcing R&D companies 2 patents (useful models) received in the project.
4 Jahre und 2 Monate, Sep. 2005 - Okt. 2009
Team Lead
Lebedev's IPMCE
Project: cardiac monitor module with RF data channel. The module can be implanted into small laboratory animals (usually rats) without any movement restrictions for them Project: avionic embedded system for control jet engine http://www.ipmce.ru/img/release/sau.pdf
3 Jahre und 7 Monate, Feb. 2002 - Aug. 2005
R&D Hardware Engineer
Open Technologies
Computer-on-module for game system (Bingo machine) in DIMM144 form factor. System based on Intel XScale PXA255. 32M Flash, 64M SDRAM, AC’97 codec, LCD with touchscreen, Linux 2.4.19. 10000 items manufactured. Full developing of electronics, writing drivers for Linux, preparing for production. Detailed description: http://bodunov.space/areas/electronics/computer-module-development
Ausbildung von Nikolay Bodunov
2 Jahre und 10 Monate, Sep. 1995 - Juni 1998
Faculty of Computational Mathematics and Cybernetics
M.V.Lomonosov Moscow State University
Supercomputer HW&SW, Phone-line modems
5 Jahre und 10 Monate, Sep. 1988 - Juni 1994
Metal Parts Manufacturing Technology
N.E.Bauman Moscow State Technical University
Metal processing
Sprachen
Englisch
Gut
Deutsch
Grundlagen
Russisch
Muttersprache