Rosdina Muhayidin

• Product life cycle management responsible for timely delivery of new product’s prototype to customers while fulfilled device, electrical and physical requirement. • Currently leading a master route project across the platform for standardisation, higher efficiency and resources effectiveness with avoidance of inheritance error from previous product.

• Lead a weak-point board to fix tape-out and design issue with/without silicon feedback before mass production start. • Spotlight award for solving transition via design issue that lead to change in company’s design manual.

• Developed an understanding of wafer's edge and backside behaviour against its process and inspection sequences. • Recognition award 3 months after joining the company on solving wafer’s breakage issue.

• Liable for inspection, analysis and recipe set up. Evaluated new tool and software – better quality monitoring with quick response time.

• Enhanced yield with alternative wafer's edge process tools. Knowledge gained through wafer's edge engineering development from defect density and integration point of view.

• Increased and stabilized yield through in-line defect monitoring and analysis with rapid excursion response and shorter problem-solving cycle time. • Recognition award for developing Kill-Ratio-Analysis and Sample-Planner-Study through collaboration with KLA-Tencor on methodology and implementation as unique solution to increase yield.

• Increased production capacity, utilization and quality parallel with customer’s demand and order.

• Improved and maintained excellent production yield. Issues were identified through baby-sitting the processes.

• Assured full compliance of ISO9000 standard. Audited the quality management system and suppliers audit assessment. Liaised with regulator bodies, customers and suppliers on product’s quality improvement.