Dipl.-Ing. Sven Spiller

Inventive problem solver in wafer process development and in design for manufacturability. Wafer processing service provider crafting engineering samples, working prototypes and providing continued support for varying levels of device production and improvement, especially Power Semiconductors and MEMS. Technology expert in wafer-level packaging / thin wafer handling / Taiko-Wafer.

New location in Berlin to improve R&D resources. Within a grown team my role focused on R&D, engineering samples and supporting the marketing of the technology. Doublecheck turned into a wafer processing service provider and Technology and Strategic Consultants for thin wafer handling in power semiconductors, 3D-SIC & wafer-level-packaging. We supported IP and business development, process integration and production ramp-up worldwide.

Start-up Company offered new technology solutions in carrierless 3-D stacked IC manufacturing and backside processing of power semiconductors, based on patent-applications for a kind of modified Taiko-Wafer. In my role I was in charge of the patent applications, strategic extension of patent portfolio, Proof of Concept / Value, Definition of R&D roadmap, Identification of R&D partners, initial sampling to potential customers, Corporate Identity, company representation and global marketing.

Development of WLCSP processes for image sensors, especially optimization of lithography processes/equipment for coating of through-silicon-vias (TSV) and the required metrological capabilities (MSA/SPC).

Mikrotechnologie / Produktionstechnik